Semiautomatic Wafer and Dicing Frame Prober

Model 3GP-4G

Applications:

  • LED, OLED
  • Discrete semiconductors e.g. diodes, transistors
  • Photodiodes
  • Power semiconductors
  • RF filters, RF-MEMS
  • Sensors

Features:

  • 8” movement range
  • Superior index time (70ms@300µm)
  • Shield enclosure
  • Fastest chip scanning system for diced wafer
  • Flexible alignment methods, pattern recognition


  • Fab management integration
  • Easy-to-use operation
  • Full graphical user interface
  • Precise driving system for probing,
  • Remote control interface (TTL, RS232C, GPIB, address lines).
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Phone: +49 (0) 351 2138640
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E-Mail: atv@atv-systems.de
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