Semiautomatic Wafer and Dicing Frame Prober

Model 3GP-4G


  • Discrete semiconductors e.g. diodes, transistors
  • Photodiodes
  • Power semiconductors
  • RF filters, RF-MEMS
  • Sensors


  • 8” movement range
  • Superior index time (70ms@300µm)
  • Shield enclosure
  • Fastest chip scanning system for diced wafer
  • Flexible alignment methods, pattern recognition

  • Fab management integration
  • Easy-to-use operation
  • Full graphical user interface
  • Precise driving system for probing,
  • Remote control interface (TTL, RS232C, GPIB, address lines).
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