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MPI TS3500 Series with WaferWallet™ = Accuracy + Flexibility + Automation
The TS3500 and TS3500-SE are equivalent in features to MPI’s well-known and established TS3000 and TS3000-SE 300 mm probe stations with the added fully-automated capability by configuring or upgrading with MPI’s unique WaferWallet™.
MPI’s solution is lowering the customer’s overall cost-of-test by providing full automation for less than other vendor’s semi-automated products.
Common practice for Device Characterization in the Modeling and New Technology Development processes is to extract data from a typical few wafers via extremely accurate IV-CV, 1/f, RF, mmW, and Load-pull measurements.
MPI’s WaferWallet™ extends the TS3500 series automation without compromising measurement capability. The WaferWallet™ is designed with five individual trays for manual, ergonomic loading of 150, 200, or 300 mm “modeling” wafers. Fully-automated tests with up to five identical wafers at different temperatures are now possible.
Returning the chuck to ambient is no longer required during the wafer loading and unloading process. With the WaferWallet™, MPI provides valuable time savings via a unique capability of load/unloading wafers while the chuck remains at any test temperature.
Simple and cost-effective manual in-tray wafer alignment via notch indicator makes initial wafer loading fast and reliable. Dependent upon operational methodology, other options include wafer Pre-aligner, ID reader or PTPA capability on the TS3500-SE are additional features increasing levels of automation.
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