Manual Wafer Probe Stations

MPI TS50, TS150, TS200 & TS300 manual probe stations are open test systems which are easy to use and cost effective, yet highly accurate. These systems have been designed for precise analysis of substrates and wafers up to 50, 150, 200 and 300 mm.

They are configured to support a wide variety of applications such as Failure Analysis, Design Validation/IC Engineering, Wafer Level Reliability, MEMS, High Power and Device Characterization and Modelling as well.

 

The MPI TS150–THZ engineering probe system is dedicated for the precise analysis of substrates and 150 mm wafers in the sub THz range cost effective tests. This manual probe station is extremely stable, with a large probe platen, and a low-profile design. Each of these essential elements are required to support a wide variety of RF and mmW applications such as broadband up to 110 GHz, banded solutions up to 1.1THz, load-pull and RF noise.

 

The MPI TS200-SE probe system incorporates ShieldEnvironment™, providing optimal EMI shielding which allows ultra-low noise device on-wafer measurements for many applications such as Device Characterization and Modeling, RF & Microwave, Failure Analysis, Design Validation, and High Power up to 200 mm wafer size.

The modular design concept of all MPI manual probe stations allows a unique upgrade path towards reduced cost of ownership.

Trennlinie
Please contact us
Address: Heilbronner Str. 17, 01189 Dresden, Germany
Phone: +49 (0) 351 2138640
Fax: +49 (0) 351 2138650
E-Mail: atv@atv-systems.de
© 2019 AutomatisierungsTechnik Voigt GmbH
First Contact in Measurement Technology

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