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MPI TS200-SE Engineering Wafer Probe System with ShieldEnvironment™
The MPI TS200-SE wafer probe systems with ShieldEnvironment™ provide maximum EMI shielding and allow low noise device on-wafer measurements for wide verity of applications such as Device Characterization and Modeling, RF/Microwave, Wafer Level Reliability, Failure Analysis, IC Engineering, and High Power.
MPI TS200-SE is the designed for cost effective on-wafer measurements without compromising the demand for high precision low noise measurement requirements. The compact and rigid platen design accommodates up to eight DC or 4 RF MicroPositioners for various application requirements. The highly repeatable platen lift design with three discrete positions for contact, separation, and loading with a safety lock utility allows for easy step and repeat functionality.
The TS200 is available with various chuck options to meet different budgets and application requirements. Chuck options include MPI's coaxial or triaxial Chucks or an ERS thermal chuck to support temperature measurement in a range from -60 °C to 300 °C. The RF chuck configuration includes two ceramic auxiliary chucks for optimal RF calibration accuracy.
The MPI TS200-SE system includes vibration absorbing base to achieve stable and reliable long-term probe to pad contact which ensures reliable measurement results. Vibration isolation table is optional available where the laboratory environment requires extensive vibration protection.
A wide range of Optics are available with a choice between stereo for common DC/CV applications or a single tube MPI SZ10 or MZ12 for RF configurations. These optics were carefully selected to meet the customer's requirements for convenient probe to pad placement.
The TS200-SE modular design concept allows a unique upgrade path. All TS200-SE probing accessories such as thermal chucks, microscope and positioners can be upgraded or reconfigured to variety of application requirements throughout its long lifespan for lower cost of ownership.
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