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MPI TS300 Engineering Wafer Probe System
MPI TS300 engineering wafer probe system is a cost effective yet highly accurate manual probe system designed for precision analysis of substrates and 300 mm wafers. The TS300 may be configured to support a wide variety of applications such as Wafer Level Reliability, Failure Analysis, IC Engineering, and MEMS.
The compact and rigid platen design accommodates up to eight DC or four RF MicroPositioners for various application requirements. The highly repeatable platen lift design with three discrete positions for contact, separation, and loading with a safety lock utility allows for easy step and repeat functionality.
The TS300 is available with various chuck options to meet different budgets and application requirements such as MPI's coaxial or RF Chucks or an ERS thermal chuck to support temperature measurement up to 300 °C at the wafer level. The RF chucks include two auxiliary chucks built in ceramic material for accurate RF calibration.
A wide range of Optics are available with a choice between stereo for common DC/CV applications or a single tube MPI SZ10 or MZ12 for RF or WLR configurations. MPI is also offers state of the art high-power microscopes such as Motic PSM-1000 and Mitutoyo FS70 configured to address internal-node probing or Failure Analysis application requirements.
The MPI TS300 system includes vibration absorbing base to achieve stable and reliable long-term probe to pad contact which ensures reliable measurement results. Vibration isolation table is optional available where the laboratory environment requires extensive vibration protection.
The TS300 modular design concept allows a unique upgrade path towards reduced cost of ownership.
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