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MPI TS50 Engineering Wafer Probe System
The MPI TS50 manual wafer probe system is specifically designed for IC Engineering, single die probing and academic use in DC/CV and RF measurement applications. The TS50 is engineered to its simplest form to allow convenient operation and providing quick set-up without compromising functionality and measurement capability.
The XY stage enables fast and independent axis movement with fine and accurate XY-Theta micrometer positioning. The probe platen has 20 mm of fine height adjustment required to support various applications.
The small footprint (300 x 300 mm) makes the MPI TS50 an ideal platform for load-pull and RF noise measurement environments. For RF applications, the TS50's 50 mm chuck is installed with a auxiliary chuck built in ceramic material for accurate RF calibration. In addition, rectangular adjustment of the two port RF MicroPositioners is a standard feature to guarantee the alignment between the RF Probes.
A wide range of Optics are available with a choice between stereo MPI ST45 for all common DC/CV applications or single tube MPI SZ10 microscope for RF or load-pull configurations. These optics were carefully selected to meet the customer's requirements for convenient probe to pad placement.
The TS50 modular design concept allows a unique upgrade path towards reduced cost of ownership to include multiple XY-stage options.
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